Samtec announced plans to demonstrate Si-Fly HD co-packaged and near-chip interconnects at SC26 in Chicago in November. The planned displays span copper and optical architectures, alongside FireFly mid-board optical engines and Bulls Eye test systems. The announcement also describes Samtec’s participation in the Open CPX ecosystem. These are planned demonstrations; the announcement does not establish that every configuration is production-qualified.
TE Connectivity launched its MINI FAKRA connector system for automotive data links, specifying RF performance up to 9 GHz and data rates up to 24 Gbps, subject to configuration and validation. The compact system targets driver assistance, vehicle cameras, V2X, antenna modules and digital cockpits. Anti-stubbing features and controlled insertion force address mating reliability and assembly in increasingly crowded vehicle architectures.
TE Connectivity outlined new AI-infrastructure interconnect demonstrations for OCP 2026, including STRADA Whisper Ultra 336G backplane and mid-plane solutions. A separate 448G demonstration was planned around a one-meter copper channel linking co-packaged copper to a cabled backplane, alongside liquid-cooled I/O. The release also described a PCIe Gen 7 path through its Ultra Low-Profile connector and cable assembly.
Editorial forecasts issued 2026-10-31. Numerical ranges are judgment, not statistical confidence intervals; predictive accuracy has not yet been demonstrated.
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Image: Samtec
Image: TE Connectivity
Image: TE Connectivity